SUSS MicroTec Launches GreenTec Solutions, Enters Wafer-Cleaning Market with GT200 System

By SoCal Editorial Team•
SUSS MicroTec has entered the wafer-cleaning market with its new GreenTec Solutions product line and GT200 system, targeting the growing advanced packaging and semiconductor manufacturing sectors with sustainable cleaning technologies.
SUSS MicroTec Launches GreenTec Solutions, Enters Wafer-Cleaning Market with GT200 System

SUSS MicroTec SE, a leading supplier of equipment and process solutions for the semiconductor industry, announced its entry into the wafer-level cleaning market with the launch of the GreenTec Solutions product line and the introduction of its first system, the GT200. The move expands SUSS' technology portfolio into a market valued at approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration, and increasing semiconductor demand from AI and high-performance computing applications.

"GreenTec Solutions marks an important milestone in the execution of our Ambition 2030 strategy," said Burkhardt Frick, Chief Executive Officer of SUSS. "By expanding into wafer-level cleaning, we are entering an attractive market with significant long-term growth potential while leveraging proven technologies and process expertise from our existing portfolio." The company's differentiated approach combines strong cleaning performance with significantly lower chemical consumption and the elimination of hazardous acids and organic solvents, addressing the semiconductor industry's growing environmental, social, and governance (ESG) needs.

At the core of the portfolio is a hybrid cleaning approach that integrates the proven SUSS process technologies TurbulenStrip™ and CrustBuster™ from its Photomask Solutions segment into a single platform. TurbulenStrip™ incorporates lower-impact batch soaking and single-wafer handling for efficient resist and residue removal, while CrustBuster™ utilizes patented in-situ UV technology to break down and remove organic materials directly at the wafer surface in a single-wafer process chamber. These technologies enable highly efficient residue removal and process stability while helping customers reduce chemical consumption, support their sustainability targets, and lower overall cost-of-ownership.

The GT200 is specifically designed for research and development, process qualification, and production in 200 mm manufacturing environments for MEMS, RF, Power Device, and CMOS applications. In addition to equipment supply, SUSS supports customers through joint evaluation programs, process co-development, and recipe optimization services to accelerate adoption and de-risk technology transfers ahead of volume production ramps. More information about the GT200 can be found at https://www.suss.com/en/products-solutions/greentec-solutions/wafer-cleaning/gt200.

Following SUSS' strategic approach, all platforms of the GreenTec Solutions product line are designed with a focus on a high degree of modularization and standardization, with the GT200 serving as the first member of a scalable GreenTec platform. SUSS will expand its portfolio toward high-volume manufacturing (HVM) with a dedicated 300 mm HVM platform in 2027, and a 200 mm HVM platform will follow in 2028. This provides customers with a clear migration path from evaluation to full-scale production.

"The GreenTec Solutions product line represents our vision for the next generation of semiconductor manufacturing - where sustainability and process excellence go hand in hand," said Yuta Nagai, Senior Vice President Photomask Solutions at SUSS. "Due to the strong interest from our customers, we are pulling in the launch of a 300 mm HVM solution."

The launch underscores SUSS' commitment to innovation and sustainability, positioning the company for future growth in advanced semiconductor manufacturing. The GT200's eco-friendly design consolidates multiple cleaning and stripping steps, reducing wafer transfers and toolset complexity, which helps fabs reduce tool fragmentation, simplify process flows, and improve operational efficiency. By combining greener process media with advanced technologies, the GT200 supports shorter process learning cycles, reduced EHS exposure, and lower chemical consumption and hazardous waste generation without compromising process performance. For more information, visit www.suss.com. Meet SUSS at SEMICON West to discover the latest developments in wafer-level cleaning; register now at https://www.suss.com/en/company/events/semicon-west.

SoCal Editorial Team

SoCal Editorial Team

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